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The Singularity of Power
AORUS Z790 series gaming motherboards fully optimise the performance within the latest Intel® 13th generation processors with Gigabytes most capable digital power design ever. The Aorus Elite AX ICE boasts a powerful, twin 16+1+2 phases digital VRM solution with 70A power stage, which ensures stable and efficient power delivery for overclocking. It also supports dual channel DDR5 memory with XMP 3.0, which enables faster and more reliable performance. The Aorus Elite AX ICE has four PCIe 4.0 x4 M.2 connectors, which provide fast and large storage capacity for games and applications. The motherboard also has an advanced thermal design with fully covered MOSFET heatsinks, a 6mm heatpipe, and a 7.5 W/mK thermal conductivity pad. The motherboard offers fast and reliable network connectivity with 2.5GbE LAN and Wi-Fi 6E 802.11ax. It also boasts multiple display outputs, such as DP and HDMI, and various USB ports, including front USB-C 10Gb/s and rear USB-C 20Gb/s. Push performance to it's limits with Gigabyte Aorus motherboards.
Intel Z790
Chipset
LGA 1700
CPU Socket
12th & 13th Gen Intel
Compatible CPU
ATX
Form Factor
Power in Numbers
All AORUS series gaming motherboards are equipped with an all-digital power design, which delivers the best stability under heavy workloads.
16 VCORE PhasesT
o unleash full potential of multi-cores CPU performance
1 VCCGT Phase
for CPU integrated GPU performance
2 VCCAUX Phases
provide stable power for CPU integrated PCIe & Memory controller
Best-in-class Compatibility
All AORUS series gaming motherboards feature multiple techniques to enhance the performance of DDR5 memory with the best compatibility with DDR5 overclocking available via a mixture of BIOS optimisations and exquisite hardware craftsmanship including XMP boosters. shielded memory routing and low-signal loss PCB.
ALL OUT Thermals
Every AORUS motherboard is armored with the most advanced, full metal thermal design. These solid heatsinks are forged to keep your system cool while running fast.
VRM Advanced Thermal Armour
High coverage MOSFETs and integrated molded heatsinks improve thermal efficiency by enhancing airflow and heat exchange.
4X Larger Surface
The surface area has been increased up to 4X larger compared to traditional heatsinks, resulting in improved heat dissipation from the MOSFETs.
One-piece Construction
The TRUE single-piece heatsink offers superior cooling performance; compared to competitors' multi-piece designs, thanks to its one-piece construction and larger surface area.
Multi-Cut Design
With its Multi-Cut Design, this heatsink includes multiple channels and inlets to enhance airflow, resulting in improved heat transfer performance.
6mm Heatpipe
6mm heatpipe helps to transfer heat between two heatsinks which improves overall thermal balance of the MOSFETs.
7.5 W/mK Thermal Pad
Optimise hardware performance with Gigabytes' advanced 7.5 W/mK thermal pad for efficient heat dissipation.
2X Copper Enhancement
Enhances system performance with improved heat dissipation, power handling, and seamless overclocking support.
PCIe UD Slot PG5
GIGABYTE widens stainless-steel shielding by 20% to reinforce PCIe slots, addressing Gen 5 SMD technology's lower weight-bearing capacity and supporting heavy-duty graphics cards.
M.2 UD Slot PG4
The one-piece, stainless-steel shielding design reinforces the M.2 Slots, and maximises signal integrity.
UD Power Connector
The unique design provides better conductivity for power and better dissipation for the heat generated from it.
Maximum Connectivity
Enable the ultimate connection experience with blazing data-transfer speeds through the next generation network, storage, latest USB connections and Wi-Fi 6E connectivity.
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