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Asus RS700-E1 Intel 3rd Gen Xeon Ice Lake 1U 12 Bay Barebone Server (1600W PSU)
(image for) Asus RS700-E1 Intel 3rd Gen Xeon Ice Lake 1U 12 Bay Barebone Server (1600W PSU)
(image for) Asus RS700-E1 Intel 3rd Gen Xeon Ice Lake 1U 12 Bay Barebone Server (1600W PSU)
(image for) Asus RS700-E1 Intel 3rd Gen Xeon Ice Lake 1U 12 Bay Barebone Server (1600W PSU)
(image for) Asus RS700-E1 Intel 3rd Gen Xeon Ice Lake 1U 12 Bay Barebone Server (1600W PSU)
  • In Stock: 10
  • Manufactured by: ASUS

Asus RS700-E1 Intel 3rd Gen Xeon Ice Lake 1U 12 Bay Barebone Server (1600W PSU)

$7,494.06
Scalable, High Performance 1U Server ASUS RS700-E10-RS12U is a server powered by 3rd Gen Intel Xeon Scalable processors that supports up to 32 DIMMs, one dual-slot GPU, 12 NVMe, three plus one PCIe slots, optional OCP 3.0 slot, dual M.2 and ASUS ASMB10-iKVM. 3rd Gen Intel Xeon Scalable...
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  • Manufactured by: ASUS
  • This product was added to our catalog on .

Scalable, High Performance 1U Server

ASUS RS700-E10-RS12U is a server powered by 3rd Gen Intel Xeon Scalable processors that supports up to 32 DIMMs, one dual-slot GPU, 12 NVMe, three plus one PCIe slots, optional OCP 3.0 slot, dual M.2 and ASUS ASMB10-iKVM.


3rd Gen Intel Xeon Scalable processors

The latest Intel Xeon scalable processors offer up to 1.42x more cores per CPU and 1.52x computing performance increase. ASUS RS700-E10-RS12U supports dual Intel Scalable processors to enable up to 32 DIMM slots, all flash and PCIe Gen 4.0.


PCIe 4.0 Ready

PCI Express® (PCIe®) 4.0 delivers 16 GT/s bandwidth, which is double the speed of PCIe 3.0, offering lower power consumption, better lane scalability and backwards compatibility.


GPU and FPGA Support

Up to one dual-slot GPU card such as NVIDIA A100 in one 1U system and optimized acceleration for workloads across cloud, data centre and for hybrid cloud environment.


Cooling Solutions

Air or liquid-cooled solutions. Asetek's Direct-to-Chip (D2C) liquid-cooling technology achieving lower power-usage effectiveness (PUE) and optimized TCO for data centres.


Enhanced Security

PFR FPGA as the platform Root-of-Trust solution for firmware resiliency Trusted Platform Module 2.0 (TPM 2.0) to secure hardware through integrated cryptographic keys and offer regular firmware update for vulnerabilities.

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Features


• Powered by dual-socket 3rd Gen Intel Scalable processors, with 32 DIMMs and support for a maximum TDP of up to 270 W per socket.
• GPU-optimized design allows one dual-slot GPU for AI workloads.
• Up to 12 all-flash NVMe drives on front panel to enable extensive storage and high-throughput performance.
• Up to three PCIe® 4.0 slots to enable higher bandwidth and improved data-transfer rates.
• Flexible onboard LAN-module design to enable four 1 Gb LAN or two 10 Gb LAN options.
• Flexible air- and liquid-cooling solution to achieve lower power-usage effectiveness (PUE) and optimized TCO for data centres.
• Onboard ASUS ASMB10-iKVM for out-of-band management with ASPEED AST2600 controller.
• Integrated PFR FPGA as the platform Root-of-Trust solution for firmware resiliency.
• High power efficiency with redundant 1600 W or 1200 W 80 Plus® Titanium/Platinum power supplies.

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