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Thermally conductive M.2 SSD interface pad is versatile and suitable for use between components and their heatsinks. The pad moulds around uneven surfaces and can be cut to size to effectively solve and manage unwanted thermal issues.
Thermal pad has a high temperature range from 40° up to 160°. Ceramic filled silicon ensures that the pad will not melt, as well as being non corrosive and non electrically conductive.
Thermal pad moulds around uneven surfaces to ensure most surface area is in contact to help conduct as much heat as possible. Pad can also be cut to size easily according with your needs.
Thermal pad can be used on a wide range of components ranging from CPU, GPU, RAM, SSD and LED’s.
• Reliable and durable.• Convenient ease of use.• Perfect Fit for M.2 2280 SSD.• Wide usage.Specifications:• Size: 70 x 20 x 1mm.• Quantity: 1.• Material: Ceramic filled silicone elastomer.• Thermal Conductivity: 1.2 W/mK.• Hardness (shore 00): 27±5.• Density: 2.1 g/cm³.• Temperature Range: -40ºC to 160ºC.• Volume Resistivity: 10 ^12 ohm-cm.
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