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Easily apply ultra-performance hybrid thermal paste to your CPU and GPU, designed for highly efficient computer setups. Perfect for overclocking enthusiasts with 10-20 applications.
Use of hybrid silicone and nano diamond micro particles ensures minimal thermal resistance for quick and efficient heat transmission. Getting the most out of your processor, air and liquid heatsink cooler. Making it perfect for overclockers.
Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.
Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.
• Thermal Conductivity: 5.2 W/mK.• Specific Gravity: 2.6.• Form: Non-curing compound.• Operating Temperature: -50°C to 250°C.• Thermal Resistance: 0.04°C-cm²/W @ 60 psi.• Colour: Grey.• Viscosity: 6,000,000 (mPa.s/ 22°C).• Weight: 5g.
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