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Crafted for the next generation
AORUS Z790 series gaming motherboards fully optimise the performance within the latest Intel® 14th generation processors. The Aorus Master X boasts a powerful 20+1+2 phase digital VRM solution, which ensures stable and efficient power delivery. It also supports dual channel DDR5 memory with XMP 3.0, which enables faster and more reliable performance. The AORUS MASTER X has 5x M.2 Connectors (1x Gen5, 4x Gen4), which provide fast and large storage capacity for games and applications. The motherboard also has an advanced thermal design with Fins-Array with NanoCarbon Coating, a 8mm heatpipe, and a 12 W/mK thermal conductivity pad. The motherboard offers fast and reliable network connectivity with 10GbE LAN and Wi-Fi 7 connectivity It also has multiple display outputs, such as DP and HDMI, and various USB ports, including front USB-C 20Gb/s and rear USB-C 20Gb/s. Push performance to it's limits with Gigabyte Aorus motherboards.
Intel Z790
Chipset
LGA 1700
CPU Socket
14th/13th/12th Gen Intel
Compatible CPU
E-ATX
Form Factor
Power in Numbers
The Z790 AORUS MASTER X motherboard is equipped with an all-digital power design to achieve peak performance of the next-gen processor while providing the best stability under heavy workloads.
20 VCORE Phases
To unleash full potential of multi-cores CPU performance
1 VCCGT Phase
for CPU integrated GPU performance
2 VCCAUX Phases
provide stable power for CPU integrated PCIe & Memory controller
Best-in-class Compatibility
GIGABYTE is committed to enabling the unparalleled performance of the Intel® Core™ 14th Gen processors. That is why every Z790 AORUS MASTER X motherboard is engineered with industry-leading technologies to achieve the best-in-class DDR5 performance on the market.
Xpress Your Cool
Every Z790 AORUS MASTER X motherboard is armored with the most advanced, full metal thermal design. These solid heatsinks are forged to keep your system cool while running fast.
VRM Thermal Armor Fins-Array
GIGABYTE's Fins-Array Heatsink Design, featuring irregular fins, louvered stacked-fins, and Nanocarbon coatingdelivers exceptional thermal performance by maximizing surface area for improved heat efficiency.
10x more surface area
Extended Irregular fins design to increase more surface area 10X total heatsink surface area.
Direct-Touch 8mm Heatpipe
Direct-Touch 8mm Heatpipe with refined manufacturing minimizes the gap between the heatpipe and heatsink, ensuring efficient MOSFET heat transfer and enhancing thermal performance.
12 W/mK Thermal Pad
Achieve unparalleled cooling capabilities with our top-of-the-line 12 W/mK thermal pad for high-performance systems.
Full Riveting Process
Efficient thermal management is achieved through improved heat conduction, optimized heat dissipation via Direct-Touch Heatpipe, and eco-friendly practices that eliminate soldering and plating, reducing pollutants and solder paste.
Nanocarbon Coating
Applying a 200μm Nanocarbon coating to the entire Fins-Array heatsink improves thermal radiation and accelerates heat dissipation, leading to a notable 10% temperature reduction in tests.
M.2 UD Slot PG5
The one-piece, stainless-steel shielding design reinforces the M.2 Slots, and maximises signal integrity.
UD Nanocarbon Backplate
Experience the ultimate support, protection, and heat dissipation with the UD Backplate.
UD Power Connector
The unique design provides better conductivity for power and better dissipation for the heat generated from it.
PCIe UD Slot X
The latest PCIe UD Slot X offers unprecedented strength, providing enhanced protection for your graphics card.
Memory UD Slot D5
The one-piece, stainless-steel shielding design reinforces the Memory Slots, and maximizies signal integrity and overclocking potential.
Maximum Connectivity
The Z790 AORUS MASTER X motherboard offers a wide range of versatilities from the cutting-edge Wi-Fi 7 support with a redesigned antenna, to an array of USB ports.
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